Bonded Fin Heat Sink India

Manufacturer of air cooled heat sinks bonded fin heat sinks soldered fin heat sinks pressed fin heat sinks and extrusion high density heat sinks offered by bsm technology solutions bengaluru karnataka.

Bonded fin heat sink india.

This type of heat sink fabrication allows for higher fin densities and fin aspect ratios than what is manufacturable with extrusion methodologies greatly improving thermal performance as compared to extruded heat sinks due to increased surface area. Bonded fin heatsinks are presisly made to eliminate this drawback of regular heatsinks. 91 9925030256 email. Bonded fin heat sinks are an assembly of a grooved base with individual fins bonded into the grooves.

Bhoomi modular systems is india s oldest and largest manufacturer of aluminium heat sink in india. Is one of india s oldest and largest heatsink suppliers serving customers across the globe. Bonded fin heat sinks. High fin density extrusion.

Bhoomi is a pioneer manufacturer of bonded fin heat sink in india. Bonded fin heat sink heatsink manufacturer in india bonded fin heat sink for a large amount of heat dissipation in small areas conventional heatsink design failt to perform. Quality being a significant issue of concern for our entity we are engrossed in offering to our customers a wide assortment of amplifier heat sink. Is one of india s oldest and largest heatsink suppliers serving customers across the globe.

Dual base bonded fin. Bonded fin heat sinks. Get contact details address of companies manufacturing and supplying led heat sink light emitting diode heat sink across india. High fin density extrusion.

Bonded fin types can be constructed in a few ways. Grooved bases can be extruded die cast or machined. Dual base bonded fin. High fin density extrusion.

Established in 1990 bhoomi modular systems p. Established in 1990 bhoomi modular systems p. High fin density extrusion. Is india s oldest and largest supplier of heatsinks card frame cabinets and other products used to remove excess heat generated by electronic components and systems.